Schneider Electric BMEXBP1002H Modicon X80 Ruggedized Rack

Configured for module mounting and X bus plus Ethernet backplane communication in the Modicon X80 platform, the Schneider Electric BMEXBP1002H (BMEXBP1002 ruggedized rack) provides the physical rack structure for BMX and BME processors, power supply modules, I/O modules, and application modules. It provides 8 X bus plus Ethernet positions and 2 X bus positions for Modicon M580 and M340 architectures.

Hardware Specifications

X Bus and Ethernet Backplane Architecture

The BMEXBP1002H provides the physical interconnection between Modicon X80 modules installed in the rack. The rack contains 8 positions supporting X bus plus Ethernet communication and 2 additional X bus positions. The backplane is compatible with Modicon M580 and M340 platforms and supports BMX and BME processors together with compatible I/O and application modules.

The rack includes an XBE connector for an expansion module. Its electrical loading is specified as 162 mA at 24 V DC and 76 mA at 3.3 V DC, with corresponding power consumption values of 3.9 W and 251 mW.

Most compatible I/O modules support hot swapping. The exact hot-swap capability depends on the installed module and its platform compatibility.

Frequently Asked Questions

Q: Does the BMEXBP1002H support hot swapping?

A: The supplied product data specifies a hot-swap feature for most I/O modules. The specific module type and system configuration must be checked before performing a live module replacement.

Q: What mounting hardware is specified for the BMEXBP1002H?

A: The rack can be mounted using 4 M6 screws on a plate, or 4 screws with a diameter of 4.32-6.35 mm when mounted on a panel.

Q: What electrical connections are provided by the rack?

A: The rack provides one XBE connector for an expansion module and carries the specified X bus and Ethernet backplane connections between compatible modules.

Field Installation Guidelines

• Install the rack on a rigid mounting plate or panel using the specified screw arrangement.
• Verify that the rack is mechanically secured before inserting processors, power supply modules, or I/O modules.
• Connect the XBE expansion interface only with compatible expansion hardware specified for the Modicon X80 architecture.
• Maintain correct module positioning according to the applicable M580 or M340 rack configuration.
• Route power and communication wiring to avoid unnecessary mechanical stress on the rack and module connectors.
• Apply the installation grounding and shielding practices specified by the applicable Modicon X80 installation documentation.
• Observe the stated operating range of -25 to 70 deg C and relative humidity of 5-95% without condensation.
• The IP20 enclosure requires installation inside an enclosure providing the environmental protection required by the installation site.
• For severe-environment installations, verify compatibility with the specified gas, dust, salt, mold, fungal-spore, ATEX, and IECEx requirements.
• Confirm module compatibility before inserting or removing modules, particularly when using the hot-swap function.