Schneider Electric BMEXBP0800 Modicon X80 Ethernet Backplane Rack

The Schneider Electric BMEXBP0800, also cataloged as the BMEXBP0800 Modicon X80 Ethernet backplane rack, provides the electrical and bus interconnection for mixed I/O, processor, power supply, and application modules in Modicon M580 and M340 architectures. It provides 8 slots with X-bus and Ethernet connections and includes an XBE expansion connector.

Hardware Specifications

Backplane Bus and Module Integration

The BMEXBP0800 provides both X-bus and Ethernet connections across its 8 module positions. The backplane accepts compatible Modicon X80 I/O and application modules together with BMXCPS power supplies and BMX or BME processors.

The rack supports in-rack module mounting and provides an electrical connection point for an XBE expansion module. The supplied product data also specifies hot-swapping for most I/O modules. Module replacement procedures must follow the applicable module and system documentation because hot-swap capability is module-dependent.

Frequently Asked Questions

Q: What is the primary electrical function of the BMEXBP0800?

A: It distributes the X-bus and Ethernet backplane connections between installed Modicon X80 modules and provides the rack-level electrical interface for compatible processors, I/O modules, power supplies, and application modules.

Q: What supply currents are specified for the backplane?

A: The specified current consumption is 164 mA at 24 VDC and 64 mA at 3.3 VDC. The corresponding power consumption data is 3.9 W at 24 VDC and 211 mW at 3.3 VDC.

Q: Can installed I/O modules be replaced while the rack is energized?

A: The supplied product information specifies a hot-swap feature for most I/O modules. The permitted replacement procedure depends on the individual module and the system configuration.

Field Installation Guidelines

• Mount the rack using the specified four-screw panel fixing, four M6 screws, or 35 mm symmetrical DIN rail clips.
• Install the rack on a mechanically stable mounting surface with sufficient clearance for module insertion and removal.
• Verify that every installed module is mechanically seated and fully engaged with the backplane connectors before energizing the system.
• Keep Ethernet and other communication wiring separated from high-current power conductors where practical to reduce electromagnetic coupling.
• Connect cable shields according to the grounding requirements of the associated Modicon system and installed communication modules.
• Verify the 24 VDC and 3.3 VDC backplane loading against the complete rack configuration rather than treating the rack current figures as the total system load.
• When using the XBE expansion connection, follow the applicable Modicon X80 rack expansion documentation for cable routing and termination.
• For hot-swapping, verify that the specific I/O module supports energized replacement before removing or installing it.