Schneider Electric BMEXBP1200 Modicon X80 12-Slot Ethernet Backplane Rack

Configured for mixed Ethernet and X-bus module interconnection in Modicon X80 systems, the Schneider Electric BMEXBP1200 (BMEXBP1200 Ethernet Backplane Rack) provides direct electrical connection between compatible I/O, processor, power supply, and application modules. The rack provides 12 module positions with 8 Ethernet/X-bus connectors and 4 X-bus connectors.

Hardware Specifications

Modicon X80 Backplane Bus and I/O Density

The BMEXBP1200 provides a shared backplane structure for Modicon X80 modules. Eight positions provide combined Ethernet and X-bus connectivity, while four positions provide X-bus connectivity. The arrangement permits mixed installation of compatible Ethernet/X-bus modules and X-bus-only modules within the same rack.

The backplane itself draws 164 mA from the 24 VDC supply and 86 mA from the 3.3 VDC supply. Module selection must remain within the applicable rack and power-supply constraints. The XBE connector provides the electrical interface for an expansion module connection.

The rack is specified for use with Modicon M580 and M340 PAC architectures and supports BMX and BME processor families together with compatible I/O, application, and power-supply modules.

Frequently Asked Questions

Q: How many module positions are available on the BMEXBP1200?
A: The rack provides 12 positions: 8 positions with Ethernet and X-bus connectivity and 4 positions with X-bus connectivity.

Q: What is the backplane current consumption?
A: The specified current consumption is 164 mA at 24 VDC and 86 mA at 3.3 VDC.

Q: Can I/O modules be replaced while the system is energized?
A: The supplied product information states that the rack supports hot swapping for most I/O modules. The hot-swap capability must therefore be verified against the specific module being replaced and the applicable system configuration.

Field Installation Guidelines

Mount the BMEXBP1200 on a suitable plate or panel using the specified fixing arrangement. The supplied data permits either four M6 screws for plate mounting or four screws with a diameter from 4.32 to 6.35 mm for panel mounting.

Install compatible X80 modules in the designated rack positions and verify their connector alignment before applying mechanical force. Connect the XBE expansion module connector where an expansion connection is required.

Maintain the specified 24 VDC and 3.3 VDC electrical supply conditions and account for the backplane current consumption when sizing the associated power architecture. Route field wiring separately from high-voltage or high-noise conductors where applicable.

The BMEXBP1200 is rated IP20. It should therefore be installed inside an enclosure that provides the required protection against accidental contact, dust, moisture, and other site-specific environmental conditions. Confirm that the installation remains within 0 to 60 deg C and 5 to 95 % relative humidity without condensation.