Schneider Electric BMEXBP0400H Modicon X80 Ruggedized Rack

The Schneider Electric BMEXBP0400H, also cataloged as the BMEXBP0400H Modicon X80 ruggedized rack, provides four X-bus and Ethernet module slots with an integrated Ethernet backplane for Modicon M340, M580, and X80 architectures. The backplane provides electrical module interconnection, XBE expansion connectivity, and 24 VDC / 3.3 VDC power distribution.

Hardware Specifications

Modicon X80 Backplane and I/O Bus Characteristics

BMEXBP0400H provides four X-bus and Ethernet positions for Modicon X80 modules. The dual-bus arrangement supports module communication and Ethernet connectivity within the rack. The XBE connector provides the electrical interface for rack expansion.

The backplane accepts Modicon X80 I/O modules, application modules, BMX processors, and BME processors. It can also be combined with compatible X80 power supply arrangements. Its conformal-coated construction and specified gas, dust, sand, salt, and fungal resistance support installation in the environmental classes stated by the manufacturer.

The rack can be mounted using panel screws, M6 plate screws, or clips on a 35 mm symmetrical DIN rail. Most I/O modules support hot swapping when the complete system configuration and module type permit this operation.

Frequently Asked Questions

Q: What electrical supply characteristics are specified for BMEXBP0400H?
A: The backplane has a specified current consumption of 118 mA at 24 VDC and 49 mA at 3.3 VDC, corresponding to the stated 24 VDC and 3.3 VDC power consumption values.

Q: How many module positions are provided?
A: The rack provides 4 X-bus and Ethernet slots for compatible Modicon X80 modules.

Q: Can BMEXBP0400H be mounted on a DIN rail?
A: Yes. The specified fixing method includes clips for a 35 mm symmetrical DIN rail, in addition to panel and plate screw mounting.

Field Installation Guidelines

Install the backplane on a mechanically stable panel or 35 mm symmetrical DIN rail and secure it according to the specified mounting method. Verify that the rack, power supply, processor, and installed X80 modules are mechanically compatible before energizing the system.

Maintain correct module orientation and ensure each module is fully seated in its backplane position. Route power and communication wiring separately where practical to reduce electromagnetic coupling. Follow the applicable grounding and shielding requirements for the complete Modicon installation.

For rack expansion, connect the XBE interface only with compatible X80 expansion hardware. Before servicing or replacing modules, verify whether the installed module supports hot swapping and follow the applicable Schneider Electric installation procedure.