Schneider Electric BMEXBP1200H Modicon X80 Ruggedized Rack

Configured for mixed Ethernet and X-bus module interconnection in the Modicon X80 platform, the Schneider Electric BMEXBP1200H (BMEXBP1200H Ruggedized Rack) provides a 12-slot electrical backplane for Modicon M580 and M340 controller architectures. The rack provides 8 Ethernet and X-bus connectors plus 4 X-bus connectors for X-bus modules.

Hardware Specifications

Ethernet and X-bus Backplane Architecture

The BMEXBP1200H provides a common electrical mounting and communication interface for Modicon X80 modules. Its 12-slot arrangement combines Ethernet and X-bus positions, allowing mixed module configurations within the same rack. The XBE expansion connector provides the electrical interface for rack expansion.

The ruggedized construction uses conformal coating and supports an extended operating temperature range of -25 to +70 deg C. The environmental specification also includes resistance classifications for gas, dust, sand, salt, mold, and fungal spores. These characteristics are specified for installations requiring the ruggedized Modicon X80 rack variant.

Frequently Asked Questions

Q: Can most I/O modules be replaced while the rack remains powered?

A: The supplied product information identifies a hot-swappable feature for most I/O modules. The specific module documentation must be checked before performing a live replacement because hot-swap behavior is module-dependent.

Q: What is the backplane current consumption?

A: The specified current consumption is 164 mA at 24 VDC and 86 mA at 3.3 VDC. The corresponding listed power consumption is 3.9 W at 24 VDC and 283 mW at 3.3 VDC.

Q: How is the BMEXBP1200H mechanically mounted?

A: The rack can be mounted on a plate using four M6 screws or on a panel using four screws with a diameter of 4.32 to 6.35 mm. Mechanical fixing should maintain the rack alignment and provide secure support for installed modules.

Field Installation Guidelines

• Mount the rack on a rigid plate or panel using the specified fixing arrangement.
• Verify that all modules are mechanically seated and fully engaged with the backplane connectors before energizing the rack.
• Keep Ethernet and X-bus wiring physically organized to avoid unnecessary cable stress at module and rack interfaces.
• Follow the applicable cabinet grounding and shielding practices for the installed control system.
• Maintain adequate separation between communication wiring and high-current or high-noise power conductors where required by the system installation rules.
• Verify the 24 VDC and 3.3 VDC backplane supply requirements against the installed module configuration before commissioning.
• Do not exceed the specified environmental operating range or humidity limits.
• For hazardous-location installations, verify that the complete installed assembly and associated modules meet the applicable ATEX, IECEx, or Class I Division 2 requirements.
• Inspect the conformal-coated rack for mechanical damage or contamination before installation.
• Confirm module compatibility and rack position requirements using the applicable Modicon X80 system documentation.