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Schneider Electric BMEXBP1002 Modicon X80 Ethernet Backplane Rack

18 em stock

Manufacturer: Schneider
Product No.: BMEXBP1002
Country of origin: France
Product Type: Modicon X80 Ethernet Backplane Rack
Condition: Completamente novo
Payment: T/T, Western Union
Weight: 1.37 kg
Shipping port: Xiamen
Warranty: 12 meses

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Configured for module interconnection in Modicon X80 systems, the Schneider Electric BMEXBP1002 (BMEXBP1002 Ethernet backplane rack) provides a 10-slot electrical backplane with Ethernet and X-bus connections for mixed PAC modules, I/O modules, processors, and power supply components.

Hardware Specifications

Parameter	Specification
Model	BMEXBP1002
Brand	Schneider Electric
Product Type	Ethernet Backplane Rack
Series	Modicon X80
Rack Capacity	10 slots
Backplane Architecture	8 Ethernet and X-bus connectors, 2 X-bus connectors
Electrical Connection	1 XBE expansion module connector
Compatible Modules	Specific application modules, I/O modules, BMXCPS4002, BMX processors, BME processors
Current Consumption	162 mA at 24 VDC; 76 mA at 3.3 VDC
Power Consumption	3.9 W at 24 VDC; 251 mW at 3.3 VDC
Weight	1.37 kg
Operating Temp	0 to 60 deg C
Relative Humidity	5 to 95% without condensation
IP Rating	IP20
Mounting	4 M6 screws on plate, or 4 screws with 4.32 to 6.35 mm diameter on panel
Standards	EN 61131-2, EN 61000-6-4, EN 61000-6-2, EN 61010-2-201

Backplane Bus and I/O Density

The BMEXBP1002 provides separate connection paths for Ethernet/X-bus mixed modules and X-bus-only modules. Eight positions provide Ethernet and X-bus connectivity, while two positions provide X-bus connectivity. The arrangement supports Modicon X80 module combinations within a 10-slot rack.

The backplane current load is specified as 162 mA at 24 VDC and 76 mA at 3.3 VDC. Module selection must remain within the available electrical capacity of the associated power supply and rack configuration.

The rack is compatible with Modicon M580 and M340 platform modules specified for the BMEXBP1002, including BME processors, BMX processors, I/O modules, specific application modules, and BMXCPS4002.

Frequently Asked Questions

Q: Can I/O modules be hot-swapped on the BMEXBP1002?

A: The product documentation specifies hot-swap capability for most I/O modules. The exact hot-swap behavior depends on the installed module and system configuration.

Q: What are the electrical consumption values of the BMEXBP1002?

A: The rack consumes 3.9 W at 24 VDC and 251 mW at 3.3 VDC. The corresponding current consumption is 162 mA at 24 VDC and 76 mA at 3.3 VDC.

Q: How is the BMEXBP1002 mechanically installed?

A: The rack can be mounted using four M6 screws on a plate, or four screws with a diameter from 4.32 to 6.35 mm when mounted on a panel.

Field Installation Guidelines

Install the rack on a rigid panel or mounting plate using the specified fixing points. Maintain mechanical alignment across the rack so that installed modules seat correctly on the backplane connectors.

Verify the 24 VDC and 3.3 VDC electrical loading against the installed module configuration before energizing the rack. Do not exceed the available power capacity of the associated power supply.

Keep Ethernet and control wiring routed separately from high-current switching conductors where practical. Maintain connector integrity during module insertion and removal, and avoid applying mechanical force to the backplane connectors.

The BMEXBP1002 has an IP20 enclosure rating and is specified for 0 to 60 deg C operation with 5 to 95% relative humidity without condensation. Install the assembly in an enclosure or control cabinet that provides the required environmental protection for the complete system.

Connect protective earth and cabinet bonding according to the applicable installation standard and control-panel design. Use appropriate cable shielding and grounding practices for the installed communication and I/O modules.

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