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Schneider Electric BMEXBP1002H Modicon X80 Ruggedized Rack

18 em stock

Manufacturer: Schneider
Product No.: BMEXBP1002H
Country of origin: France
Product Type: Modicon X80 Ruggedized Rack
Condition: Completamente novo
Payment: T/T, Western Union
Weight: 1.37 kg
Shipping port: Xiamen
Warranty: 12 meses

Descrição
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Configured for module mounting and X bus plus Ethernet backplane communication in the Modicon X80 platform, the Schneider Electric BMEXBP1002H (BMEXBP1002 ruggedized rack) provides the physical rack structure for BMX and BME processors, power supply modules, I/O modules, and application modules. It provides 8 X bus plus Ethernet positions and 2 X bus positions for Modicon M580 and M340 architectures.

Hardware Specifications

Parameter	Specification
Model	BMEXBP1002H
Base Model	BMEXBP1002
Brand	Schneider Electric
Product Range	Modicon X80
Product Type	Ruggedized rack
Rack Configuration	8 X bus + Ethernet slots; 2 X bus slots
Compatibility	BMX processor, BME processor, BMXCPS4002, I/O modules, specific application modules
Electrical Connection	1 XBE connector for expansion module
Current Consumption	162 mA at 24 V DC; 76 mA at 3.3 V DC
Power Consumption	3.9 W at 24 V DC; 251 mW at 3.3 V DC
Net Weight	1.37 kg
Operating Temp	-25 to 70 deg C
Relative Humidity	5-95% without condensation
IP Rating	IP20
Mounting	4 M6 screws on plate; or 4 screws with 4.32-6.35 mm diameter on panel
Protective Treatment	Conformal coating
MTBF	1184170 h
Certifications	CE, UL, CSA, RCM, EAC, Merchant Navy, ATEX zone 2/22, IECEx zone 2/22
Environmental Classes	Gas resistant Gx / 3C4; dust and sand resistant 3S4; salt resistant level 2; mold and fungal spore resistant 3B2
Environmental Data	Total lifecycle carbon footprint: 214 kg CO2 eq.

X Bus and Ethernet Backplane Architecture

The BMEXBP1002H provides the physical interconnection between Modicon X80 modules installed in the rack. The rack contains 8 positions supporting X bus plus Ethernet communication and 2 additional X bus positions. The backplane is compatible with Modicon M580 and M340 platforms and supports BMX and BME processors together with compatible I/O and application modules.

The rack includes an XBE connector for an expansion module. Its electrical loading is specified as 162 mA at 24 V DC and 76 mA at 3.3 V DC, with corresponding power consumption values of 3.9 W and 251 mW.

Most compatible I/O modules support hot swapping. The exact hot-swap capability depends on the installed module and its platform compatibility.

Frequently Asked Questions

Q: Does the BMEXBP1002H support hot swapping?

A: The supplied product data specifies a hot-swap feature for most I/O modules. The specific module type and system configuration must be checked before performing a live module replacement.

Q: What mounting hardware is specified for the BMEXBP1002H?

A: The rack can be mounted using 4 M6 screws on a plate, or 4 screws with a diameter of 4.32-6.35 mm when mounted on a panel.

Q: What electrical connections are provided by the rack?

A: The rack provides one XBE connector for an expansion module and carries the specified X bus and Ethernet backplane connections between compatible modules.

Field Installation Guidelines

Install the rack on a rigid mounting plate or panel using the specified screw arrangement.
Verify that the rack is mechanically secured before inserting processors, power supply modules, or I/O modules.
Connect the XBE expansion interface only with compatible expansion hardware specified for the Modicon X80 architecture.
Maintain correct module positioning according to the applicable M580 or M340 rack configuration.
Route power and communication wiring to avoid unnecessary mechanical stress on the rack and module connectors.
Apply the installation grounding and shielding practices specified by the applicable Modicon X80 installation documentation.
Observe the stated operating range of -25 to 70 deg C and relative humidity of 5-95% without condensation.
The IP20 enclosure requires installation inside an enclosure providing the environmental protection required by the installation site.
For severe-environment installations, verify compatibility with the specified gas, dust, salt, mold, fungal-spore, ATEX, and IECEx requirements.
Confirm module compatibility before inserting or removing modules, particularly when using the hot-swap function.

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