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Configured for module mounting and X bus plus Ethernet backplane communication in the Modicon X80 platform, the Schneider Electric BMEXBP1002H (BMEXBP1002 ruggedized rack) provides the physical rack structure for BMX and BME processors, power supply modules, I/O modules, and application modules. It provides 8 X bus plus Ethernet positions and 2 X bus positions for Modicon M580 and M340 architectures.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | BMEXBP1002H |
| Base Model | BMEXBP1002 |
| Brand | Schneider Electric |
| Product Range | Modicon X80 |
| Product Type | Ruggedized rack |
| Rack Configuration | 8 X bus + Ethernet slots; 2 X bus slots |
| Compatibility | BMX processor, BME processor, BMXCPS4002, I/O modules, specific application modules |
| Electrical Connection | 1 XBE connector for expansion module |
| Current Consumption | 162 mA at 24 V DC; 76 mA at 3.3 V DC |
| Power Consumption | 3.9 W at 24 V DC; 251 mW at 3.3 V DC |
| Net Weight | 1.37 kg |
| Operating Temp | -25 to 70 deg C |
| Relative Humidity | 5-95% without condensation |
| IP Rating | IP20 |
| Mounting | 4 M6 screws on plate; or 4 screws with 4.32-6.35 mm diameter on panel |
| Protective Treatment | Conformal coating |
| MTBF | 1184170 h |
| Certifications | CE, UL, CSA, RCM, EAC, Merchant Navy, ATEX zone 2/22, IECEx zone 2/22 |
| Environmental Classes | Gas resistant Gx / 3C4; dust and sand resistant 3S4; salt resistant level 2; mold and fungal spore resistant 3B2 |
| Environmental Data | Total lifecycle carbon footprint: 214 kg CO2 eq. |
X Bus and Ethernet Backplane Architecture
The BMEXBP1002H provides the physical interconnection between Modicon X80 modules installed in the rack. The rack contains 8 positions supporting X bus plus Ethernet communication and 2 additional X bus positions. The backplane is compatible with Modicon M580 and M340 platforms and supports BMX and BME processors together with compatible I/O and application modules.
The rack includes an XBE connector for an expansion module. Its electrical loading is specified as 162 mA at 24 V DC and 76 mA at 3.3 V DC, with corresponding power consumption values of 3.9 W and 251 mW.
Most compatible I/O modules support hot swapping. The exact hot-swap capability depends on the installed module and its platform compatibility.
Frequently Asked Questions
Q: Does the BMEXBP1002H support hot swapping?
A: The supplied product data specifies a hot-swap feature for most I/O modules. The specific module type and system configuration must be checked before performing a live module replacement.
Q: What mounting hardware is specified for the BMEXBP1002H?
A: The rack can be mounted using 4 M6 screws on a plate, or 4 screws with a diameter of 4.32-6.35 mm when mounted on a panel.
Q: What electrical connections are provided by the rack?
A: The rack provides one XBE connector for an expansion module and carries the specified X bus and Ethernet backplane connections between compatible modules.
Field Installation Guidelines
- Install the rack on a rigid mounting plate or panel using the specified screw arrangement.
- Verify that the rack is mechanically secured before inserting processors, power supply modules, or I/O modules.
- Connect the XBE expansion interface only with compatible expansion hardware specified for the Modicon X80 architecture.
- Maintain correct module positioning according to the applicable M580 or M340 rack configuration.
- Route power and communication wiring to avoid unnecessary mechanical stress on the rack and module connectors.
- Apply the installation grounding and shielding practices specified by the applicable Modicon X80 installation documentation.
- Observe the stated operating range of -25 to 70 deg C and relative humidity of 5-95% without condensation.
- The IP20 enclosure requires installation inside an enclosure providing the environmental protection required by the installation site.
- For severe-environment installations, verify compatibility with the specified gas, dust, salt, mold, fungal-spore, ATEX, and IECEx requirements.
- Confirm module compatibility before inserting or removing modules, particularly when using the hot-swap function.
Plaćanje: T/T, Western Union.
Luka otpreme: Siamen.
Rok isporuke: Obično 1–3 radna dana nakon potvrde uplate (u zavisnosti od zaliha).
Isporuka širom sveta: Šaljemo delove za industrijsku automatizaciju kupcima širom sveta. Troškovi prevoza se navode u vašem RFQ-u.
Česta pitanja (FAQ)
Najčešća pitanja o ponudama, isporuci, garanciji i povraćaju robeNa stranici proizvoda kliknite na Zatražite ponudu i pošaljite nam broj dela, potrebnu količinu i zemlju odredišta. Naš prodajni tim će odgovoriti informacijama o trenutnoj dostupnosti, ceni i procenjenom roku isporuke.
Artikli koji su na stanju obično se pripremaju nakon uplate i potvrde porudžbine. Većina porudžbina šalje se iz našeg skladišta u Kini, iako mesto slanja može da varira u zavisnosti od trenutnog stanja zaliha.
Da. Šaljemo delove za industrijsku automatizaciju kupcima širom sveta. Troškovi i vreme isporuke zavise od odredišta, težine paketa, veličine proizvoda i lokalnih uvoznih zahteva.
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